均普智能：完成2亿元2026年度第一期科技创新债券发行

Core Viewpoint - The company has announced its approval to issue up to 800 million yuan in medium-term notes and short-term financing bonds, with a total issuance amount not exceeding 800 million yuan [1] Group 1 - The company received registration approval from the trading association on January 7, 2026, with a registration quota valid for two years [1] - On February 12, 2026, the company completed the issuance of its first phase of technology innovation bonds for 2026, named "26 Junpu Intelligent MTN001 (Tech Innovation Bond)" [1] - The total planned and actual issuance amount for the technology innovation bond is 200 million yuan, with a maturity of two years and an issuance interest rate of 2.49% [1]