快克智能：HBF与HBM结构类似，均依托Chiplet异构集成、CoWoS封装与3D堆叠

Core Viewpoint - Kuake Intelligent has indicated that HBF and HBM structures are similar, both relying on Chiplet heterogeneous integration, CoWoS packaging, and 3D stacking [1] Group 1: Technology Development - The company is currently developing TCB thermal compression bonding equipment specifically for HBM stacking processes [1] - Future iterations of the equipment will be based on specific applications of HBF [1]