崇达技术2026年端侧IC封装载板项目启动，高管计划减持股份

Company Project Advancement - The company plans to invest 1 billion yuan to establish a production base for integrated circuit packaging substrates for end-side chips through its subsidiary, Jiangsu Punowei Electronics Co., Ltd. The project is scheduled for land listing in May 2026, construction to begin in September 2026, and is expected to be completed and put into production by September 2028, aiming to expand the company's capacity in the high-end IC substrate sector [2]. Executive Share Reduction - The company's Vice General Manager, Jiang Shuguang, plans to reduce his holdings by no more than 2 million shares, which accounts for no more than 0.1642% of the company's total share capital, between January 16, 2026, and April 15, 2026. This decision is based on personal financial needs, with the shares originating from the company's pre-IPO holdings [3].