三佳科技：公司子公司三佳山田长期专注于半导体专用设备的研发与制造

Group 1 - The core viewpoint of the article highlights that Sanjia Technology's subsidiary, Sanjia Shantian, has become an important supplier of packaging equipment in China, focusing on the research and manufacturing of semiconductor-specific equipment [2] - The company is responding to the explosive growth in AI computing power, which is driving demand for HBM (High Bandwidth Memory) chips and 5G RF chips [2] - The project aims to address the urgent needs of advanced packaging forms such as MAP BGA and MAP QFN, focusing on breakthroughs in key technologies for ultra-low forming and high-precision plastic packaging equipment with substrate sizes within 100×300 [2]