三星、海力士“调整战略”：新存储工厂生产计划提前

Core Viewpoint - The demand for memory chips driven by artificial intelligence is prompting South Korean giants Samsung Electronics and SK Hynix to accelerate the production timeline of new wafer fabs, shifting their strategy from cautious inventory control to aggressive capacity expansion to capture the "super cycle" benefits in the industry [1]. Group 1: Production Expansion Plans - SK Hynix plans to advance the trial operation of its Longjing Phase I wafer fab to February-March next year, ahead of its completion date [1][2]. - Samsung Electronics is moving the production timeline of its P4 factory from Q1 next year to Q4 this year, compressing the schedule by about three months [1][2]. - Both companies will focus on high-value products such as high-performance DRAM and HBM in their new production lines [1][2]. Group 2: Market Demand and Supply Dynamics - The surge in server chip demand due to the expansion of AI data centers has led to a significant increase in memory chip demand, with a fulfillment rate of only about 60% as of February this year [1][4]. - Samsung's memory shipments have seen approximately 70% absorbed by AI data center companies [4]. - Market expectations indicate that supply tightness will persist until 2027, with demand growth rates for DRAM and NAND flash projected at 20.1% and 21.4%, respectively, outpacing supply growth rates of 17.5% and 16.5% [4][5]. Group 3: Capital Expenditure and Strategic Intent - Both Samsung and SK Hynix have announced plans to increase capital expenditures this year to address memory shortages, with Samsung's memory division indicating a significant expansion in equipment investment by 2026 [6]. - The companies are attempting to signal stable supply to customers by rapidly entering trial operation phases, despite the inherent delays in achieving stable mass production [6].