盛合晶微科创板IPO将于今日上会 携高增长业绩冲刺马年新股

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is set to be reviewed for its initial public offering on the STAR Market, potentially becoming a significant semiconductor company in the A-share market [1] Financial Performance - The company is projected to achieve a compound annual growth rate (CAGR) of nearly 70% in revenue from 2022 to 2024, with 2025 expected to reach new heights [3] - Revenue figures for 2022, 2023, and 2024 are 1.633 billion, 3.038 billion, and 4.705 billion yuan respectively, with a net profit of 34.13 million yuan in 2023 and an increase to 214 million yuan in 2024 [3] - For 2025, the company anticipates revenue of 6.521 billion yuan, a year-on-year increase of 38.59%, and a net profit of 923 million yuan, reflecting a growth of 331.80% [3] - The first quarter of 2026 is expected to generate revenue between 1.650 billion and 1.800 billion yuan, with net profit projections showing significant growth [3] Market Position and Technology - Shenghe Jingwei is a leading player in the advanced packaging and testing segment of the integrated circuit industry in mainland China, focusing on mid-stage silicon wafer processing and advanced packaging [4] - The company has established itself as a leader in several core business areas, including being one of the first in mainland China to achieve mass production of 12-inch bumping technology [5] - In the wafer-level chip-scale package (WLCSP) sector, the company ranks first in revenue in mainland China with a market share of approximately 31% [5] - The company leads the 2.5D integration technology market in mainland China with an 85% market share in 2024 [5] Research and Development - The company has invested 1.149 billion yuan in R&D from 2022 to 2024, accounting for 12.25% of its revenue during the same period [6] - As of June 30, 2025, the company holds 229 patents, including 157 domestic and 72 international patents, with over 99% of its revenue derived from core technologies [6] - The IPO proceeds will be used to fund projects aimed at enhancing multi-chip integration packaging capabilities, which are crucial for supporting the growth of digital economy and AI sectors [6]