Group 1 - The stock of 澜起科技 (06809) increased by approximately 6%, reaching HKD 208.8 with a trading volume of HKD 264 million [1] - SK Hynix reported that its DRAM and NAND inventory has dropped to a "very low level" of about 4 weeks and is expected to continue decreasing throughout the year [1] - Samsung is negotiating the pricing of its latest AI storage chip HBM4, which is expected to be 20% to 30% higher than the previous generation, with an estimated price of around USD 700 [1] Group 2 - First Shanghai's research report indicates that with the advent of the AI era, the performance of computing chips is rapidly increasing, and interconnectivity is becoming a bottleneck for AI computing clusters [2] - The interconnect chip business is expected to experience significant growth, driven by upgrades from DDR4 to DDR5 and even DDR6, as well as enhancements from PCIe 4.0 to 6.0 and 7.0 [2] - The introduction of the CXL standard for memory pooling is anticipated to greatly enhance the value of related interface chips, positioning the interconnect chip industry for a new cycle of rapid development [2]