盛合晶微科创板IPO过会，与主要客户的业务稳定性等遭追问

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has successfully passed the IPO review on the Sci-Tech Innovation Board, marking it as the first IPO of the year of the horse [1] Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuits, starting with advanced 12-inch silicon wafer processing [1] - The company provides a full range of advanced packaging and testing services, including wafer-level packaging (WLP) and chiplet multi-chip integration packaging [1] - The focus is on supporting high-performance chips, particularly graphics processing units (GPUs), central processing units (CPUs), and artificial intelligence chips, aiming for significant performance improvements in computing power, bandwidth, and energy efficiency through heterogeneous integration beyond Moore's Law [1] IPO Details - The company aims to raise 4.8 billion yuan through this IPO [1] - The IPO was accepted on October 30, 2025, and entered the inquiry stage on November 14 of the same year [1] - During the listing committee meeting, the company was required to explain the technical sources of its 2.5D business, the application fields and market space of three technology routes, and the stability of its business with major clients and sustainability of performance [1]