马年首家IPO过会 盛合晶微拟募资48亿元冲刺科创板

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has successfully passed the listing review by the Shanghai Stock Exchange for its IPO on the Sci-Tech Innovation Board, marking it as the first company to be approved in the Year of the Horse [1][2]. Group 1: Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuit wafers, focusing on advanced 12-inch silicon wafer processing and providing full-process advanced packaging services such as wafer-level packaging (WLP) and chiplet multi-chip integration packaging [3]. - The company aims to support various high-performance chips, particularly graphics processing units (GPUs), central processing units (CPUs), and artificial intelligence chips, by enhancing performance through heterogeneous integration that surpasses Moore's Law, achieving high computing power, high bandwidth, and low power consumption [3]. Group 2: IPO Details - The company plans to raise 4.8 billion yuan through its IPO on the Sci-Tech Innovation Board [1]. - The Shanghai Stock Exchange's listing committee has requested Shenghe Jingwei to elaborate on the technical sources of its 2.5D business, the application fields and market potential of three technology routes, and the stability of its business with major clients to ensure sustainable performance [3]. - The review results indicate that Shenghe Jingwei has no further issues to address before proceeding with the IPO [3]. Group 3: Industry Context - The ongoing implementation of reforms in the Sci-Tech Innovation Board is facilitating the acceleration of hard-tech enterprises in sectors such as semiconductors and artificial intelligence to connect with the capital market [3]. - The rapid advancement of Shenghe Jingwei to the meeting stage after multiple rounds of review reflects the inclusiveness, adaptability, competitiveness, and attractiveness of the capital market system [3].