飞凯材料：目前公司在半导体制造及先进封装领域已形成锡球、环氧塑封料、光刻胶及湿制程电子化学品等产品矩阵

Group 1 - The core viewpoint of the article highlights that the PCB-related materials industry is becoming increasingly competitive, leading to lower profit margins, prompting the company to exit this segment [2] - The company has shifted its strategic focus towards the semiconductor materials sector, which offers higher value-added technology [2] - The company has established a product matrix in the semiconductor manufacturing and advanced packaging fields, including products such as solder balls, epoxy molding compounds, photoresists, and wet process electronic chemicals [2]