兴森科技:公司CSP封装基板业务行业整体需求较好,后期公司将根据市场需求情况适时启动扩产

Industry Overview - The global PCB industry is expected to continue its recovery trend with structural differentiation, driven primarily by the AI industry [2] - According to Prismark, the global PCB market value is projected to reach $84.891 billion in 2025, representing a year-on-year growth of 15.4% [2] Company Performance - The demand for the company's CSP packaging substrate business remains strong, and the company plans to initiate capacity expansion based on market demand [2] - The company's FCBGA packaging substrate business is progressing steadily in market expansion and customer certification as planned [2] - The total number of shareholders as of February 10, 2026, is over 127,000 [2]

FAST PRINT-兴森科技:公司CSP封装基板业务行业整体需求较好,后期公司将根据市场需求情况适时启动扩产 - Reportify