马年首家IPO过会，盛合晶微拟募资48亿元

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has successfully passed the listing review by the Shanghai Stock Exchange for its IPO on the Sci-Tech Innovation Board, becoming the first company to be approved in the Year of the Rabbit [1] Group 1: Company Overview - Shenghe Jingwei is a leading global advanced packaging and testing enterprise for integrated circuits, specializing in advanced 12-inch silicon wafer processing and providing full-process advanced packaging services [1] - The company focuses on supporting high-performance chips, particularly GPUs, CPUs, and AI chips, aiming to enhance performance through heterogeneous integration that surpasses Moore's Law, achieving high computing power, high bandwidth, and low power consumption [1] Group 2: Financial Performance - For the years 2023, 2024, and the first half of 2025, Shenghe Jingwei is projected to achieve operating revenues of 3.038 billion yuan, 4.705 billion yuan, and 3.178 billion yuan, respectively, with net profits attributable to the parent company of 34.13 million yuan, 214 million yuan, and 435 million yuan [1] Group 3: IPO Details - The company plans to raise 4.8 billion yuan through its IPO, which will be allocated to projects including three-dimensional multi-chip integration packaging and ultra-high-density interconnect three-dimensional multi-chip integration packaging, focusing on scaling the chiplet multi-chip integration packaging technology platform and enhancing bump manufacturing capacity [1] Group 4: Shareholding Structure - In the past two years, Shenghe Jingwei has had no controlling shareholder or actual controller. As of the signing date of the prospectus, the largest shareholder, Wuxi Industrial Development Fund, holds a 10.89% stake, while the second largest shareholder, the Zhuhai Bank system, controls 9.95%, and the third largest shareholder, the Houwang system, holds 6.76% [2]