Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is advancing towards its IPO on the Sci-Tech Innovation Board, marking a significant step in its journey to become a publicly listed company [1] Company Overview - Shenghe Jingwei is a leading global provider of integrated circuit wafer-level advanced packaging and testing services, starting with advanced 12-inch mid-size silicon wafer processing [1] - The company offers a full range of advanced packaging services, including wafer-level packaging (WLP) and chiplet multi-chip integration packaging, aimed at supporting high-performance chips such as GPUs, CPUs, and AI chips [1] Technological Focus - The company is committed to enhancing performance through heterogeneous integration methods that exceed Moore's Law, achieving improvements in computing power, bandwidth, and energy efficiency [1] IPO Details - The IPO application was accepted on October 30, 2025, and was approved on February 24, 2026 [1] - Shenghe Jingwei plans to raise approximately 4.8 billion yuan through this IPO [1]
提交注册！盛合晶微科创板IPO闯进“注册关”
Bei Jing Shang Bao·2026-02-25 13:41