功率半导体厂商集体提价，科创芯片设计ETF天弘(589070)标的指数逆市涨近2%

Core Viewpoint - The Tianhong Sci-Tech Chip Design ETF (589070) has shown significant trading activity and growth, driven by strong performance in the semiconductor sector, particularly in domestic GPU companies and power semiconductor price increases. Group 1: ETF Performance - As of February 26, 2026, the Tianhong Sci-Tech Chip Design ETF (589070) had a turnover rate of 15.7%, with a transaction volume of 95.6682 million yuan, indicating active market trading [1] - Over the past two weeks, the ETF's scale increased by 12.6982 million yuan, with a growth of 14 million shares, reflecting substantial growth [2] - In the last 13 trading days, the ETF attracted a total inflow of 47.3619 million yuan [3] Group 2: Industry Highlights - Domestic GPU is a core area for semiconductor localization, with market share of domestic GPU design companies rising from 5% to 12% over the past three years, indicating significant replacement potential [4] - The National Big Fund Phase III is focusing on supporting high-end chip design, providing R&D funding and market resources for domestic GPU companies [4] - Increased demand for self-controlled computing power in sectors such as government, finance, and energy is expected to accelerate market share capture by domestic GPU companies, presenting excess return opportunities for the ETF [4] Group 3: Market Events - On February 25, domestic power semiconductor manufacturers collectively announced price increases, with companies like Xinjieneng raising MOSFET product prices by at least 10% due to rising costs of raw materials and manufacturing [5] - The power semiconductor industry is experiencing a collective price adjustment, with companies like Silan Micro and Huayi Technology also raising prices, indicating an improving supply-demand balance and ongoing industry growth [5] Group 4: Institutional Insights - Guolian Minsheng Securities noted that the storage industry chain is benefiting from increased AI demand, with Micron investing $50 billion to expand its Boise facility and build two new wafer fabs expected to start production in 2027 [6] - The price of HBM4 has increased significantly, with new generation HBM4 chips priced at $700 each, reflecting a 20-30% increase compared to HBM3E [6] - Lanke Technology successfully listed on the Hong Kong Stock Exchange, raising approximately 6.9 billion HKD, with plans to allocate about 70% of the funds for R&D in interconnect chips, focusing on AI server and cloud computing infrastructure opportunities [6]