上海骄成超声波技术股份有限公司2025年度业绩快报公告

Core Viewpoint - The company, Shanghai Jiao Cheng Ultrasonic Technology Co., Ltd., reported significant growth in its 2025 financial performance, driven by increased demand in the new energy battery, connector, and semiconductor sectors, alongside ongoing technological innovations and product optimizations [3][4]. Financial Data and Indicators - The company achieved an operating income of 774.01 million yuan, representing a year-on-year increase of 32.41% [3]. - The net profit attributable to the parent company was 114.92 million yuan, up 33.83% compared to the previous year [3]. - The net profit after deducting non-recurring gains and losses reached 92.32 million yuan, marking a substantial increase of 132.50% year-on-year [3]. - Total assets at the end of the reporting period were 2.37 billion yuan, an increase of 11.54% from the beginning of the period [3]. - The equity attributable to the parent company was 1.80 billion yuan, reflecting a growth of 6.36% [3]. Business Performance and Financial Condition - The company focuses on the research, design, production, and sales of ultrasonic equipment, providing specialized solutions in ultrasonic applications and intelligent equipment [4]. - The growth in revenue was attributed to the rapid expansion of the downstream markets for new energy vehicles and energy storage, as well as the company's continuous improvement in technological platforms and product offerings [4]. - The comprehensive gross profit margin improved due to an optimized product sales structure and diversified business layout, which mitigated the impact of cyclical fluctuations in specific downstream industries [4]. Product Development and Market Expansion - In the power ultrasonic sector, the company expanded its product offerings in the new energy battery field, including equipment for welding battery cell terminals and high-voltage busbar welding [5]. - The company has developed a complete product matrix for connector applications, enhancing its competitive edge in high-voltage harnesses while making breakthroughs in low-voltage harnesses [5]. - In the semiconductor sector, the company has established a comprehensive solution set for ultrasonic equipment, covering critical processes in power semiconductor packaging and advanced packaging [6]. - The ultrasonic scanning microscope developed by the company has successfully entered the market for detecting internal defects in various components, breaking the reliance on imported high-end ultrasonic detection equipment [7]. Future Outlook - The company aims to continue enhancing its product matrix and advancing applications in the semiconductor advanced packaging sector, leveraging its comprehensive ultrasonic technology platform for sustainable business development [8].