China's top chip bosses urge supportive policies to create 'China's ASML'

Core Viewpoint - Top Chinese semiconductor executives are advocating for a coordinated national effort to develop operational lithography systems from 2026 to 2030, emphasizing the need for technological self-reliance in the semiconductor industry [1] Semiconductor Industry and National Strategy - Executives from leading semiconductor companies, including Naura Technology Group and Yangtze Memory Technologies Corp, have called for the government to pool national resources to achieve technological breakthroughs [1] - The article highlights that semiconductor manufacturing has become a critical area in the China-U.S. technology rivalry, particularly since 2020, with the U.S. imposing restrictions on China's advanced production capabilities below 7-nanometer [1] - The executives pointed out that ASML's extreme ultraviolet (EUV) lithography machines consist of 100,000 components from 5,000 suppliers, indicating the complexity of developing a similar system in China [1] - The article identifies bottlenecks in electronic design automation (EDA) software, silicon wafers, and electronic gases as key areas needing national-level coordination [1] - China's chip production capacity at the mature 28nm node and above accounts for 33% of global capacity, with no restrictions in manufacturing and design for these nodes [1] - The Chinese government has designated semiconductors as a core pillar of its industry, alongside aviation, biotechnology, and the low-altitude economy, as stated in the latest government work report [1]