Broadcom (AVGO) Ships 3.5D Face-To-Face Compute SoC

Group 1 - Broadcom Inc. has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D XDSiP platform, which combines 2.5D and 3D-IC integration for next-generation XPUs, enhancing power efficiency and signal density for AI clusters [1] - Wolfe Research upgraded Broadcom to Outperform from Peer Perform, setting a price target of $400, and expects the company to ship 7 million tensor processing units by 2028, with a bullish scenario predicting a doubling of AI revenue by 2027, leading to $18 earnings per share [2] - Broadcom is a global supplier of semiconductor devices and infrastructure software services, providing networking connectivity, wireless device connectivity, and a suite of private cloud offerings, including VMware Cloud Foundation and private AI solutions [3]