三星在英伟达GTC大会上首次展示下一代AI芯片HBM4E

Group 1 - Samsung Electronics showcased a new chip at NVIDIA's GTC conference, highlighting its role as a key partner for NVIDIA's upcoming Vera Rubin platform [1] - The company introduced Hybrid Copper Bonding (HCB), a new packaging technology designed to overcome the physical limitations of traditional thermal compression bonding [1] - HCB technology enables the next generation of High Bandwidth Memory (HBM) to achieve stacking of 16 layers or more while reducing thermal resistance by over 20% [1] Group 2 - Other cutting-edge technologies developed for NVIDIA's AI infrastructure include HBM4 and SOCAMM2, both of which are currently in mass production [1]