Samsung Elec and AMD sign MoU on AI memory, explore foundry partnership

Core Insights - Samsung Electronics and AMD have signed a memorandum of understanding to enhance their strategic partnership in memory chip supplies for AI infrastructure [1][2] - The agreement includes the supply of Samsung's next-generation high-bandwidth memory (HBM4) for AMD's Instinct MI455X AI accelerators and optimized DDR5 memory for AMD's sixth-generation EPYC processors [2][3] Group 1: Partnership Details - Samsung will serve as a key HBM4 supplier for AMD's next-generation AI GPUs, building on its previous role as the primary HBM supplier for AMD's MI350X and MI355X accelerators [3] - The companies will explore opportunities for a foundry partnership, where Samsung could provide contract chip manufacturing services for future AMD products [2][3] Group 2: Market Context - The collaboration reflects a competitive landscape among global chipmakers to secure long-term supply partnerships for advanced memory, driven by increasing AI demand [4] - Samsung, holding a 22% share of the global HBM market, aims to close the gap with market leader SK Hynix, which has a 57% share [5]