Will TSM's Advanced Packaging Push Unlock a New Growth Phase?

Key Takeaways TSM is expanding into advanced packaging, targeting growth as AI chips need complex integration.Advanced packaging made 8% of Taiwan Semiconductor's revenues in 2025, seen topping 10% in 2026.Taiwan Semiconductor plans up to 20% of 2026 capex for packaging amid rising AI-driven demand.Taiwan Semiconductor Manufacturing Company (TSM) , also known as TSMC, is expanding beyond wafer fabrication by investing heavily in advanced packaging technology. This segment is becoming critical as AI and high ...