Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform

The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence® Celsius™ Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. (Graphic: Business Wire)The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence® Celsius™ Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in ...