Viking Technology Introduces Industry's Highest Density 16GB DDR4 Multi-Chip Package (MCP)

Core Insights - Viking Technology, a division of Sanmina Corporation, has launched a new 16GB DDR4 Multi-Chip Package (MCP) designed for embedded systems and rugged applications, emphasizing performance, efficiency, and compactness [1][2] Product Features - The 16GB DDR4 MCP offers high storage capacity in a compact BGA footprint, enhancing memory density and speed compared to previous models [2] - The design features soldered connections for improved ruggedness, providing significant space savings over standard DIMM modules [2] - The product delivers superior signal integrity and high memory bandwidth efficiency, contributing to lower motherboard costs [2] Application and Performance - The MCP has proven its reliability in demanding environments, including missile applications and fighter jets, enhancing guidance systems and ensuring mission success [3] - Its integration into Digital Signal Processing (DSP) boards allows for advanced signal processing capabilities, facilitating real-time data analysis in complex battlefield situations [3] Company Background - Viking Technology has over 25 years of experience in engineering, design, manufacturing, and testing, providing advanced hardware products for various markets, including defense and aerospace [5] - Sanmina Corporation, a Fortune 500 company, is recognized as a technology leader in integrated manufacturing solutions, serving sectors such as industrial, medical, and defense [6]