半导体行业更新报告：IDAS设计自动化产业峰会

Investment Rating - The report assigns an "Overweight" rating to the semiconductor industry [2]. Core Insights - The report emphasizes the importance of establishing industry standards and unifying model parameter specifications for the healthy development of the EDA industry [3]. - There is a noticeable integration of DTCO systems with both manufacturing and design processes, enhancing collaboration [3]. - Key updates from the IDAS Design Automation Industry Summit include a stronger focus on early-stage design planning, challenges posed by Chiplet technology, and the blurring lines between chip testing and packaging [3]. Summary by Sections Chip Design - Increased emphasis on early-stage design layout and the establishment of packaging design standards and chip library models [3]. Chiplet & Packaging - Challenges from Chiplet technology include thermal effects and electromagnetic interference, necessitating improvements in EDA tools for electromagnetic and thermal simulation [3]. Chip Testing - Leading domestic manufacturers believe that the boundaries between chip testing and packaging are becoming increasingly blurred, indicating a trend towards enhanced collaboration among testing machines, probes, and sorting machines [3]. Chip Manufacturing - Smart chip manufacturing encompasses the "tape-out, testing, and virtual manufacturing" stages, with AI models expected to reduce process time and costs [3]. - Intelligent EDA tools are deeply integrated with manufacturing processes, and DTCO collaboration is effectively applied in HBM and AI chips [3].