电子周跟踪：华为Mate70系列发布，24Q3全球晶圆代工行业收入同比增长27%

Investment Rating - The report maintains an "Outperform" rating for the electronic industry, indicating expected growth exceeding the benchmark index by over 10% [2][6]. Core Insights - The global wafer foundry industry revenue grew by 27% year-on-year and 11% quarter-on-quarter in Q3 2024, driven by strong AI demand and a rapid recovery in the Chinese market [6][66]. - The launch of Huawei's Mate 70 series showcases significant advancements in performance, with a 40% improvement over previous models, highlighting innovation in the flagship smartphone market [66]. - TSMC plans to introduce a super-sized CoWoS packaging technology by 2027, which will support high-end AI and HPC processors, indicating a trend towards advanced packaging solutions [66]. Market Overview - The overall market saw an increase during the week of November 25-29, 2024, with the Shanghai Composite Index rising by 1.81%, Shenzhen Component Index by 1.66%, and the ChiNext Index by 2.23% [20][21]. - The semiconductor sector performed well, with the Wind Semiconductor Index increasing by 3.67% [20][21]. Segment Performance - The digital chip design sector led the weekly gains with a rise of 5.03%, followed by semiconductors at 3.25% and electronic chemicals at 2.75% [20][22]. - Notable individual stock performances included Beishidake (+80.19%), Kangguan Technology (+29.08%), and Fangzheng Technology (+28.61%) [31][32]. Industry News - TSMC's new 2nm plant in Kaohsiung is expected to begin operations ahead of schedule, with major clients like Apple and AMD anticipated to be among the first customers [66]. - The report highlights a projected 4.9% growth in global laptop shipments in 2025, driven by business demand and economic recovery factors [66].