电子行业周报：华为Mate系列手机正式发布，2026年全球先进封装市场规模将达522亿美元

Industry Investment Rating - The report maintains an Overweight rating on the electronics industry [4] Core Views - AI Edge Devices: ByteDance's Doubao released the AI-powered smart earphone Ola Friend, which integrates with the Doubao large model and app, enabling voice interaction without opening the phone. The AI edge device market is expected to benefit from this innovation [13][14] - Huawei Supply Chain: Huawei officially launched the Mate series smartphones, which is expected to drive the replacement cycle and benefit related supply chains [14] - Domestic Substitution: The domestic semiconductor equipment market is projected to grow by 35% in 2024, reaching over 110 billion RMB, with market share increasing to 30%, up by 5 percentage points from 2023 [15] - Advanced Packaging: The global advanced packaging market is expected to reach $52.2 billion** by 2026, accounting for **54%** of the total packaging market, driven by the increasing importance of advanced packaging in the era of computing power [15][17] Market Performance Review - **A-share Market**: The Shenwan Electronics Index rose by **2.38%** during the week (11.25-11.29), outperforming the CSI 300 Index by **1.06 percentage points** but underperforming the GEM Composite Index by **0.96 percentage points**. The semiconductor sector led with a **3.25%** increase [21][23] - **Overseas Markets**: The Hang Seng Tech Index rose by **2.53%**, while the Philadelphia Semiconductor Index fell by **0.59%**, and the Taiwan Electronics Index dropped by **3.34%** [26][29] Investment Recommendations - **AI Edge Devices**: Focus on companies like **Goertek**, **Edifier**, **Bestechnic**, **Espressif Systems**, and **Zhongke Lanxun** [18] - **Huawei Supply Chain**: Key companies to watch include **Dongmu**, **O-film**, **Furi Electronics**, **Lingyi**, and **Guanghong Technology** [18] - **Domestic Substitution**: Recommended companies include **NAURA**, **AMEC**, **Piotech**, **Kingsemi**, **Wanye Enterprises**, **Hwatsing**, **Huafeng Measurement**, **Fortune Precision**, **JCET**, and **Jiangfeng Electronics** [18] - **Advanced Packaging**: Focus on **Yongxiang Electronics**, **Zhongfu Circuit**, **JCET**, and **Lanxun Electronics** [18] Industry News - **Huawei Mate Series**: The Ministry of Industry and Information Technology completed the model approval process, supporting the smooth launch of Huawei's Mate series smartphones [34] - **Semiconductor Packaging**: The global semiconductor packaging market is expected to reach **$ 89.9 billion in 2024, with advanced packaging projected to grow to $52.2 billion by 2026, accounting for 54% of the market [34][35] - Domestic Semiconductor Equipment: The domestic semiconductor equipment market is expected to grow by 35% in 2024, exceeding 110 billion RMB, with market share increasing to 30% [35] Company Updates - Fenghua Advanced Tech: Showcased high-end products at the Munich Electronics Show, including high-temperature MLCCs and large-current inductors [40] - Lens Technology: Consumer electronics and automotive projects have reached a certain scale, with some projects already profitable [40] - Kaishan Technology: The one-time molding test line is under equipment installation, and the synthetic silica project is in the debugging phase [41] - Luxshare Precision: Acquired Leoni's equity to enhance its competitive advantage in the global automotive wiring harness market [42]