Darbond Technology (688035) 海通国际·2024-12-31 00:35Investment Rating - The report assigns an "Outperform" rating to Darbond Technology with a target price of RMB 58.55 per share [1][48] Core Views - Darbond Technology plans to acquire 89.42% of Taijino for RMB 257.78 million, aiming to enhance its semiconductor packaging materials sector, particularly in high-performance and advanced packaging [96] - The acquisition is expected to expand Darbond's product range and business scope in high-performance packaging, with forecasted 2024E-2026E revenue of RMB 1.10/1.45/1.81 billion and net profit of RMB 0.09/0.15/0.21 billion [96] - Using a PE valuation of 55x for 2025E, the market capitalization is estimated at RMB 8.33 billion [1] Business Overview - Darbond Technology specializes in high-end electronic packaging materials, including integrated circuit packaging, smart terminal packaging, new energy application materials, and high-end equipment application materials [7] - The company has achieved technological breakthroughs in areas such as integrated circuit packaging, smart terminal packaging, power battery packaging, and photovoltaic shingling packaging, with a complete R&D and production system [7] - Darbond has established long-term partnerships with leading industry customers and has entered the supply chains of many well-known brands, achieving import substitution or international leadership in related fields [7] Financial Forecasts - Revenue for 2024E-2026E is projected to be RMB 1.10 billion, RMB 1.45 billion, and RMB 1.81 billion, with year-on-year growth of 18.16%, 31.53%, and 24.80% respectively [71] - Net profit (before non-recurring items) for 2024E-2026E is forecasted at RMB 0.09 billion, RMB 0.15 billion, and RMB 0.21 billion, with year-on-year growth of -11.96%, 67.07%, and 40.23% respectively [71] - Gross margins for 2024E-2026E are expected to be 26.06%, 29.62%, and 31.26% respectively [25] Acquisition Details - The acquisition of Taijino, which specializes in high-end thermal interface materials for semiconductor integrated circuit packaging, will be paid in three installments: 30% within 10 days of agreement, 50% within 10 days post-transaction, and 20% after performance commitments [13][96] - Taijino's products, such as phase change materials and liquid metal, are used in data centers, consumer electronics, and automotive domains, and have gained recognition from leading chip design companies and AI server manufacturers [23] Industry and Market Position - Darbond Technology is a national-level "Little Giant" enterprise focused on the R&D and industrialization of high-end electronic packaging materials, with a strong presence in strategic emerging industries such as integrated circuits, smart terminals, and new energy [7] - The company is a key player in the semiconductor materials sector, with significant investments from the National Integrated Circuit Industry Investment Fund [31]