Investment Rating - The industry investment rating is maintained as "Add" [5] Core Insights - Samsung plans to achieve 1000-layer NAND by 2030 and has introduced 400-layer wafer bonding technology. The average price fluctuation for 22 NAND products last week ranged from 0.00% to 3.45%, with an average change of 0.49% [1][24] - TrendForce forecasts that the global DRAM industry revenue will reach 28 billion for the DRAM industry in Q4 2024, with a 9.9% increase from the previous quarter and a significant 63.8% increase from the previous year's low [1][22] - The price fluctuation for 18 DRAM products last week ranged from -1.16% to 2.47%, with an average change of 0.20% [1] HBM Market - SK Hynix has begun construction on its first wafer fab in the Yongin semiconductor cluster, expected to be completed by May 2027, which will focus on producing next-generation DRAM chips like HBM [2][22] - The HBM industry is anticipated to grow rapidly due to increased demand from advanced computing chips [3] Investment Recommendations - The report suggests a positive outlook for the HBM supply chain and semiconductor recovery, recommending stocks such as Saiteng Co., Yishitong, and Huahai Chengke [3] - For storage chips, the report recommends Dongxin Co. and suggests attention to Zhaoyi Innovation and Hengshuo Co. due to rising demand driven by AI [3]
电子行业存储芯片周度跟踪：三星电子提升NAND堆叠层数，存储现货行情分化
甬兴证券·2025-03-06 05:07