鸿日达（301285）：积极打造3D打印等新业务增长曲线，半导体散热片产能加速释放助力公司业绩提升

Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected stock price increase of over 15% relative to the industry index within the next six months [4][17]. Core Insights - The company is actively developing new business growth curves, particularly in 3D printing and semiconductor heat sinks, which are expected to enhance its performance [1][2]. - The company has a solid foundation in the 3C consumer electronics connector and MIM component business, while also exploring new business areas to diversify its product line [1][2]. - The semiconductor heat sink business is progressing steadily, with plans to establish 6-8 production lines by the end of 2025 to meet downstream customer demand [2]. Financial Performance Summary - Revenue is projected to grow from 721 million yuan in 2023 to 1.721 billion yuan in 2026, reflecting a compound annual growth rate (CAGR) of approximately 38.9% [1][3]. - The net profit attributable to the parent company is expected to increase from 31 million yuan in 2023 to 211 million yuan in 2026, with a significant growth rate of 141.3% in 2025 [1][3]. - The company's return on equity (ROE) is forecasted to rise from 2.7% in 2023 to 14.9% in 2026, indicating improved profitability [1][3]. Business Development Summary - The company has completed the development of its 3D printing equipment, which is now in mass production, and is committed to ongoing R&D investments in this technology [1][2]. - The company has established a comprehensive self-research process from machine development to product printing and post-processing, providing one-stop services for clients [1]. - The company is focusing on expanding its market presence in various sectors, including 3C consumer electronics, automotive radar, and semiconductor cooling [1][2].