野村证券：全球先进封装

ANCHOR REPORT Global Markets Research 19 February 2025 Global Advanced Packaging The evolution of CoWoS, SoIC and InFO Given the growing importance of advanced packaging (AP) in enabling the integration of multiple heterogeneous chips with improved performance, we believe AP is likely to evolve in the following ways from 2025F onwards: (1) CoWoS technology will shift from CoWoS-S to CoWoS-L/R; (2) SoIC adoption could increase further driven by HBM5 and potential adoption in Apple products beyond 2026F; and ...