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科创债专题研究系列(五):科创债全景透视:政策演进、发展现状与国际经验
Zhong Cheng Xin Guo Ji·2025-07-11 09:07
  1. Report Industry Investment Rating No information provided in the document. 2. Core View of the Report In the critical period of China's economic transformation towards high - quality development and accelerated industrial restructuring, the capital market's support for technological innovation has entered a new stage. The launch of the "Technology Board" in the bond market in early May and the subsequent deployment at the Lujiazui Forum have further enriched the multi - level capital market system. Although the sci - tech innovation bond market is still in the cultivation stage and faces some structural problems, overseas mature markets have accumulated useful experience in supporting technological innovation financing, which can provide important references for China. In the future, efforts should be made to build a long - term mechanism for the bond market to serve technological innovation, deepen the function of the "Technology Board" in the bond market, and provide strong financial support for China's high - level technological self - reliance and strength [2][4]. 3. Summary According to Relevant Catalogs Policy Evolution - China's sci - tech innovation bond development can be divided into three stages: the pilot exploration period (2015 - 2020), the rapid growth period (2021 - 2024), and the multi - level development period (2025 to date). In the pilot exploration period,双创孵化债 and双创债 were piloted to broaden direct financing channels. In the rapid growth period, products like sci - tech corporate bonds and sci - tech notes were launched, and the market scale expanded rapidly. In the multi - level development period, the "Technology Board" was launched, and a series of measures were taken to improve the market [2][4][5]. Development Status - The sci - tech innovation bond market has expanded rapidly to a trillion - level scale. As of June 17, 2025, the cumulative issuance scale this year is close to 90 billion yuan, and the stock scale is about 230 billion yuan, accounting for over 70% of the total issuance scale of innovative varieties. - The issuance is mainly short - to medium - term, with a further short - term tendency, which has a certain mismatch with long - term capital needs. - There is a cost advantage, with an average issuance cost lower than that of bonds of the same term and type. - The issuer structure is mainly central and local state - owned enterprises, accounting for about 90%, and the issuers' credit ratings are mainly above AA +, with AAA - rated entities issuing the most bonds. - Traditional industries have a relatively high scale, and emerging industries are actively exploring issuance. After the new regulations in May, financial institutions issued a large number of sci - tech innovation bonds. - Regional performance is differentiated, with Beijing, Shanghai, Shandong, and Guangdong having larger issuance scales, and the issuance in the eastern coastal areas is relatively more active [2][10][11]. Contradiction Analysis - The sci - tech innovation bond market is in the cultivation stage and has structural problems. The issuer structure is differentiated, with insufficient support for small and medium - sized enterprises. - Investors have a low risk preference, and their lack of willingness to buy low - quality sci - tech innovation bonds affects the bond structure. - The trading activity is average, and the market liquidity needs to be improved. - The application of credit enhancement tools is insufficient, and the risk - sharing function remains to be realized [2][23][25]. International Experience - Developed countries support technological innovation financing through multiple means, including building a multi - level capital market system, developing high - yield bond and ABS markets, optimizing the stock - bond - loan linkage model, introducing patient capital, and using funds, index products, and derivatives markets to balance risks [28][30][32]. Policy Recommendations - Anchor the direction of technological innovation, combine the enterprise life cycle to open up diversified financing channels, and deepen the construction of the "Technology Board" in the bond market. - Optimize the investment - side ecosystem, introduce diversified funds, and improve market liquidity. - Further improve the risk - sharing and credit - enhancement mechanism to strengthen risk sharing. - Guide the market to objectively view and correctly understand risks, and give full play to the role of credit ratings in risk disclosure [34][36][38].