Minsheng Securities·2025-08-03 09:21Investment Rating - The report maintains an "Outperform" rating for the industry [1]. Core Insights - The report highlights that AI is driving upgrades in upstream materials for PCB, with quartz fabric reshaping the competitive landscape and leading companies emerging [1]. Summary by Sections Section 1: Copper Clad Laminate (CCL) - The performance requirements for CCL are increasing due to enhanced computational efficiency [3]. - CCL is an essential material in PCB manufacturing, made from reinforced materials like glass fiber cloth and resin, coated with copper foil [8]. - High-frequency and high-speed CCL are designed for high-frequency signal transmission, requiring low dielectric constant and loss [11]. - The demand for CCL is expected to rise as AI development and data transmission speeds increase, with Df values projected to drop below 0.006 [16]. - The PCB industry is projected to grow approximately 5% year-on-year in 2024, with the global server PCB market expected to reach $16 billion by 2026, reflecting a CAGR of 12.8% from 2022 to 2026 [19]. Section 2: Electronic Fabric - The quality requirements for electronic-grade glass fiber fabric are high, with Low-Dk electronic yarn being a core material for high-frequency PCBs [34]. - Different grades of electronic fabric have varying performance indicators, with Q fabric currently being the best choice [38]. - The demand for electronic fabric is increasing due to the high-performance requirements of AI servers and 5G base stations [48]. Section 3: Quartz Fiber - Quartz fiber, with a silica content of over 99.90%, exhibits excellent thermal resistance and electrical insulation properties, making it suitable for aerospace, military, and semiconductor applications [58]. - The production of high-purity quartz fiber involves complex processes, and companies like Feilihua have established significant capabilities in this area [66][72]. - The competitive landscape for quartz fiber is evolving, with high-purity quartz fibers expected to dominate the third-generation electronic fabric market [59].