Micron Technology(US:MU)2025-09-04 15:08Investment Rating - The report maintains an "Overweight" (OW) rating for SK Hynix, Samsung Electronics, and Micron Technology, indicating a positive outlook for these companies in the memory market [25][27][29]. Core Insights - The HBM4 qualification timeline is largely unchanged, with expectations for customer sampling results by November 2025 and small volume production in Q1 2026. Hynix is positioned to potentially lead in setting specification standards [3][4]. - Memory makers are responding to NVDA's request for higher HBM4 read/write speed specifications, which could impact qualification timelines and yield rates. The initial HBM4 specifications are expected to align with JEDEC4 standards [3][5]. - The total addressable market (TAM) for HBM4 in 2026 is projected to be between $8 billion and $9 billion, with SK Hynix expected to capture the majority of this market share [4][5]. Summary by Sections HBM4 Qualification and Market Dynamics - HBM4 qualification is anticipated to begin with customer sampling in late 2025, with Hynix and Samsung expressing confidence in meeting the new specifications [3][4]. - The competitive landscape is intensifying, with NVDA adopting a conservative approach to supplier qualification, which may lead to price negotiations among memory makers [3][4]. Pricing and Profitability - HBM4 pricing is expected to be 30-40% higher than HBM3E due to increased complexity and die size, with both memory makers aiming to maintain profitability through high price premiums [5][8]. - HBM3E pricing may face downward pressure as demand shifts towards HBM4, with potential upside risks in the ASIC segment [5][8]. Long-term Growth and Market Trends - The report emphasizes the long-term growth potential of the HBM market, particularly driven by AI inferencing needs, projecting a 47% CAGR from 2024 to 2029 [5][8]. - Memory consumption is expected to increase significantly, necessitating higher bandwidth solutions to support advanced AI applications [5][8].