华为公布AI芯片路线图，全球最强超节点2025Q4上市

Investment Rating - The report recommends attention to domestic AI computing targets, indicating a positive outlook for the industry [6][7]. Core Insights - The report highlights Huawei's AI chip roadmap, with the Ascend 950PR chip set to launch in Q1 2026 and the Ascend 970 in Q4 2028. The Ascend 910C was launched in Q1 2025, followed by the Ascend 950PR and 950DT in 2026, and the Ascend 960 in Q4 2027 [6][7]. - Huawei's Ascend 970 chip will feature a computing power of 4 PFLOPS (FP8) and 8 PFLOPS (FP4), with an interconnect bandwidth of 4 TB/s and HBM memory capacity of 288 GB, which is competitive compared to NVIDIA's Blackwell Ultra GB300 [6][7]. - The Atlas 950 SuperPoD, expected to launch in Q4 2025, will be the world's strongest supernode, with over 300 units deployed by September 2025, serving more than 20 clients [7][8]. - Huawei's strategy includes hardware openness and software open-source initiatives, allowing industry self-development and integration into existing systems [8]. Summary by Sections - AI Chip Roadmap: Huawei's roadmap includes the launch of the Ascend 950PR in Q1 2026 and the Ascend 970 in Q4 2028, with significant advancements in chip technology and performance metrics [6][7]. - Supernode Development: The Atlas 950 SuperPoD and Atlas 960 SuperPoD will support a large number of Ascend cards, leading in various performance metrics and expected to dominate the market for years [7][8]. - Open Technology Strategy: Huawei is committed to an open technology approach, providing access to supernode technology and components for industry partners, fostering innovation and development [8].