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半导体与半导体生产设备行业周报、月报:长江存储开发TSV封装技术,台积电2nm制程涨价-20250929
Guoyuan Securities·2025-09-29 09:15

Investment Rating - The report maintains a "Recommended" investment rating for the semiconductor and semiconductor equipment industry [5] Core Insights - The semiconductor industry is experiencing significant fluctuations in stock performance, with notable increases in AI chip indices both domestically and internationally, indicating a growing market interest [1][11] - The high bandwidth memory (HBM) market is projected to grow nearly threefold from 2024 to 2026, with HBM3E expected to dominate the market [2][22] - The global VR headset market is declining due to weak consumer demand, while the AR smart glasses market is showing strong growth, with a 50% year-on-year increase in shipments [2][28] Market Indices Summary - The overseas AI chip index rose by 0.54% this week, with Marvell increasing over 10% and Broadcom decreasing by 3.0% [1][11] - The domestic AI chip index increased by 5.2%, with notable gains from companies like 澜起科技 (over 10% increase) [1][11] - The storage chip index saw a 6.1% rise, with 聚辰股份 experiencing over 50% growth [1][11] - The power semiconductor index rose by 7.0%, with all component stocks showing upward trends [1][11] Industry Data Summary - The HBM market is expected to grow from 9.9 billion Gb to 27.6 billion Gb between 2024 and 2026, with HBM3E maintaining a market share of approximately 70% in 2024 [2][22] - The global smartphone average selling price (ASP) is projected to rise from $370 in 2025 to $412 in 2029, with a CAGR of 3% [30][32] - The AR smart glasses market is expected to continue its growth trajectory, driven by new product launches and advancements in optical technology [2][28] Major Events Summary - 长江存储 is developing TSV packaging technology for HBM production and plans to utilize its new Wuhan factory for DRAM chip production [3][34] - TSMC plans to increase its 2nm process pricing by 50%, creating cost pressures for clients like Qualcomm and AMD [3][34] - OpenAI has signed an agreement with Apple's assembler,立讯精密, to develop a consumer device that collaborates with AI models [3][12]