半导体与半导体生产设备行业周报、月报：长鑫HBM3E预计采用MR-MUF封装技术，特斯拉规划建设大型晶圆厂-20251110

Investment Rating - The report maintains a "Recommended" investment rating for the semiconductor and semiconductor production equipment industry [7]. Core Insights - The global semiconductor market reached a total of $208.4 billion in Q3 2025, with a significant year-on-year growth of 25.1% [25]. - The AI chip index saw a decline of 6.4% this week, while the domestic AI chip index increased by 0.4% [1]. - The storage chip index continued to rise by 5.8%, indicating a sustained improvement in market conditions and price increases [1]. - Major events include Tesla's plans to build a large wafer factory with a monthly capacity of up to one million wafers and Changxin Storage's plan to mass-produce HBM3 using MR-MUF packaging technology in 2026 [3][40]. Market Index - The overseas AI chip index decreased by 6.4%, with Nvidia and AMD experiencing declines of over 7% [10]. - The domestic A-share chip index increased by 0.4%, with notable gains from Cambrian (4.2%) and slight increases from other companies [10]. - The server ODM index fell by 9.0%, with significant drops from Supermicro and Quanta [11]. - The storage chip index rose by 5.8%, driven by a favorable market environment and price increases [15]. - The power semiconductor index decreased by 2.5%, indicating a lack of significant growth in this segment [15]. Industry Data - The Americas region saw a quarter-on-quarter growth of 22.2%, while the Asia-Pacific region grew by 19.2% and China by 10.2% in Q3 2025 [25]. - The global smartphone market showed a mild recovery with a 4% year-on-year increase in shipments, totaling 320 million units in Q3 2025 [26]. - The expected global smartphone shipment for 2026 is projected to reach 1.255 billion units, with a growth rate of approximately 2.8% [31]. Major Events - The AI inference data surge is driving structural growth in the storage market, leading to a supply-tight cycle in the NAND market and noticeable price increases [39]. - Tesla is planning to establish a large factory for chip production and has announced a roadmap for its self-developed AI chips [40]. - Changxin Storage is set to adopt MR-MUF packaging technology for its HBM3 production, enhancing its competitive edge in high-stacking processes [41].