Investment Rating - The report maintains a "Recommended" investment rating for the semiconductor and semiconductor production equipment industry [6]. Core Insights - The advanced packaging sector is expected to face a supply shortage in 2026, with major players like ASE, SPIL, and Amkor leading the market [3]. - The global smartphone market is projected to grow, driven by strong demand for the iPhone 17 series, with a 1.5% increase in shipments expected for 2025 [3][30]. - The report highlights significant growth in the foldable smartphone segment, with a 14% year-on-year increase in Q3 2025 shipments, marking a record high for this category [2][26]. Market Indices Summary - The overseas AI chip index rose by 1.20% this week, with Marvell increasing nearly 11% and Nvidia and MPS both up over 3% [1][9]. - The domestic AI chip index saw a 0.5% increase, with companies like SMIC and Cambrian Technologies showing gains between 1% and 3% [1][9]. - The server ODM index increased by 1.5%, with Wistron up 4.4% and other major players like Supermicro and Hon Hai Precision also seeing gains [1][10]. - The storage chip index declined by 3.2%, with Beijing Junzheng and Zhaoyi Innovation showing gains, while others faced significant declines [1][10]. - The power semiconductor index increased by 2.9%, indicating a stable market performance [1][10]. Major Events Summary - The AI chip packaging market is expected to be dominated by ASE, SPIL, and Amkor over the next five years, with TSMC ramping up advanced packaging capacity [3][29]. - Moore Threads went public on December 5, raising approximately 7.576 billion yuan, with expectations of profitability starting in 2027 [3][29]. - The report notes that the iPhone 17 series has significantly boosted smartphone shipments, but there are concerns about storage chip shortages and rising costs impacting 2026 [3][30]. - Nvidia's new AI server is expected to enhance inference performance for various AI models by up to 10 times, showcasing its competitive edge in the AI inference market [3][31].
半导体与半导体生产设备行业周报、月报:先进封装2026年供不应求,摩尔线程上市科创板-20251208