电子行业深度分析：终端主动散热时代将至，微型风扇有望率先拉开规模化序幕

Investment Rating - The report maintains an investment rating of "Outperform the Market - A" [5] Core Insights - The report highlights the transition to active cooling solutions in electronic devices, driven by increasing heat density from SoC chips and the rise of edge AI applications [1][3] - Passive cooling methods are facing limitations, leading to a growing adoption of active cooling technologies such as micro fans and liquid cooling systems [3][4] - The market for heat spreaders, particularly vapor chambers (VC), is expected to grow significantly, with global sales projected to reach $2.776 billion by 2031, reflecting a CAGR of 15% from 2025 to 2031 [2][51] Summary by Sections 1. SoC Chip Heat Density and Edge AI - The report discusses the increasing heat flow density in SoC chips due to continuous process iterations, which has led to rising power consumption and localized high heat density issues [1][14] - The performance of edge AI is expected to accelerate, increasing the urgency for enhanced cooling solutions in electronic devices [21][24] 2. Passive Materials and Devices - Passive cooling technologies, including metal heat sinks, graphite, and heat pipes, are evolving, but each has its limitations [2][34] - Vapor chambers are identified as a key upgrade direction, with their market penetration expected to rise significantly, especially with the introduction of products like the iPhone 17 Pro [2][46] 3. Transition to Active Cooling - The report notes that passive cooling solutions are reaching their limits, prompting a shift towards active cooling technologies in smartphones and other thin devices [3][4] - Micro fans are becoming increasingly common in non-gaming smartphones, with brands like OPPO and Honor integrating them into their devices [3][25] 4. Focused Companies - The report identifies several companies as key players in the industry, including Suzhou Tianmai, Feirongda, Lingyi Zhi Zao, and others, which are involved in the development of advanced cooling solutions [4][30]