电子行业专题：AIPCB浪潮，关注M9材料升级机会

Investment Rating - The report maintains an "Overweight" rating for the electronic industry [1] Core Insights - The AI wave is driving higher value consumption in CCL (Copper Clad Laminate) materials, with a focus on M9 material upgrades and four main lines of development [4][8] - The demand for high-performance electronic materials is expected to surge, particularly with the anticipated release of Nvidia's Rubin platform in 2026, which will require M9-level CCL using Q-glass [8][29] - The supply of high-performance electronic materials is facing constraints, particularly in Low Dk electronic cloth and HVLP copper foil, leading to a supply-demand imbalance [8][35] Summary by Sections CCL and Key Materials - CCL's cost structure shows that upstream raw materials account for approximately 90% of the total cost, with copper foil, resin, and glass fiber being the primary components [13][15] - The transition from M7 and M8 to M9 CCL is underway, with M9 expected to utilize high-performance Q-glass and HVLP4 copper foil as the next mainstream products [21][36] Electronic Cloth - The global low dielectric electronic cloth market is projected to grow significantly, with a compound annual growth rate (CAGR) of 23.8%, reaching approximately $1.94 billion by 2033 [24][26] - The industry is transitioning from first-generation to second-generation low dielectric cloth, with a notable shift towards Q-glass for M9 applications [29][30] HVLP Copper Foil - HVLP copper foil has evolved to HVLP4, which is expected to become the mainstream product for AI server applications by 2026 [41][44] - Major manufacturers like Mitsui and Jincheng are accelerating production to meet the high demand for advanced copper foil [42][44] Electronic Resins - The use of hydrocarbon resins in M9 is expected to increase significantly, with a ratio of 2:1 compared to PPO, enhancing the value of resin in M9 materials [45][48] - The market for hydrocarbon resins is currently dominated by overseas suppliers, but domestic companies are ramping up production capabilities [49][52] Fillers - The use of spherical silica powder is increasing, with a projected market size exceeding 61,685.97 tons by 2026, driven by the demand for high-speed substrates [53][56] - Liquid-phase preparation methods for silica are becoming the industry standard, meeting the requirements for M7 and above [53][54] Other Upstream Materials - Electronic-grade copper oxide powder is crucial for high-end PCB upgrades, accounting for about 6% of PCB costs [57][60] - The market for PCB-specific electronic chemicals is evolving towards higher-end products, with domestic suppliers increasingly replacing foreign ones [61][62]