Dongxing Securities·2026-01-26 10:09Investment Rating - The report suggests a positive investment outlook for the hybrid bonding technology, highlighting its critical role in the AI era and advanced packaging market [7]. Core Insights - Hybrid bonding is identified as a key enabling technology for overcoming performance bottlenecks in the post-Moore era, driven by explosive demand in AI and high-performance computing (HPC) [7]. - The market for hybrid bonding equipment is expected to experience significant growth, with demand projected to increase several times by 2030, particularly in high-performance computing and memory applications [5][44]. - The report emphasizes the competitive landscape, noting that while overseas companies like BESI dominate the market, domestic players in China are making significant strides [5][57]. Summary by Sections Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [14][28]. - The technology enables interconnect distances below 10μm, significantly enhancing data transmission bandwidth compared to traditional methods [29]. Market Demand and Growth - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with major manufacturers like TSMC and Samsung adopting it for next-generation products [5][33]. - The global hybrid bonding equipment market is projected to exceed $600 million by 2030, with the Chinese market expected to surpass $400 million [48]. Key Players and Competitive Landscape - BESI holds a dominant position in the hybrid bonding equipment market, with a market share of approximately 67% in 2023, and is expected to maintain around 70% in 2024 [57]. - Domestic companies such as Tuojing Technology and Baiao Chemical are rapidly advancing, with Tuojing Technology launching its first mass-production hybrid bonding equipment [5][57]. Applications and Future Trends - Hybrid bonding is primarily applied in 3D NAND and is expanding into high-performance computing scenarios, including HBM4 and HBM5 technologies [25][44]. - The report indicates that the technology is becoming essential for various applications, including AI chips and advanced memory solutions, with significant investments being made in new packaging facilities globally [43][44].