Huaan Securities·2026-01-29 12:55Investment Rating - The report does not explicitly state an investment rating for the diamond heat dissipation industry, but it highlights significant growth potential and market opportunities [1][23]. Core Insights - The diamond material exhibits superior thermal conductivity, making it a promising candidate for high-performance chip cooling solutions, especially as chip integration and power density increase [4][15]. - The diamond heat sink material has a thermal conductivity of 2000-2500 W/(m·K), which is four times that of copper and eight times that of aluminum, ensuring stability during temperature cycling [15][16]. - The market for diamond heat dissipation is projected to reach 9.7 billion yuan by 2032, indicating a substantial growth opportunity as technology matures [23][24]. Summary by Sections 1. Diamond Materials: Excellent Chip Cooling Materials - High-power chip cooling issues need urgent solutions, with diamond materials expected to be widely applied in aerospace, electronics, and other rapidly developing fields [4][6]. - The MPCVD method is identified as the optimal approach for producing semiconductor diamond materials, offering high purity and quality [21][19]. 2. Related Companies: World, Sifangda, Guojijinggong - World: A leading enterprise in superhard tools, with a stable revenue growth of 12.54% in 2024, focusing on diamond materials [26][28]. - Sifangda: A leader in composite superhard materials, with a focus on self-developed MPCVD equipment to expand applications in precision tools and chip heat sinks [30][33]. - Guojijinggong: A leading enterprise in superhard materials, showing accelerated revenue and net profit growth, with a focus on MPCVD equipment [34].