电子行业周报：高通推出骁龙X Plus，日月光称先进封装供不应求

Investment Rating - The report maintains an "Overweight" rating for the electronics industry [1]. Core Insights - Qualcomm has launched the Snapdragon X Plus platform, accelerating the development of computing chips. The Snapdragon X Plus features the Qualcomm Oryon™ CPU, which outperforms competitors by up to 37% while consuming 54% less power. It is designed to meet the demands of AI applications with a computing power of 45 TOPS, making it the fastest NPU for laptops globally. The report anticipates that AI will drive an increase in computing demand, benefiting the related industry chain [4][5]. - SK Hynix's development of 12-layer stacked HBM3E memory is expected to be completed by Q3 2024, with a focus on 8Hi HBM3E memory for 2024 and preparation for a comprehensive increase in demand for 12Hi HBM3E by 2025. The report suggests that major storage manufacturers are actively advancing the production of cutting-edge memory chips, which will benefit the industry chain [4][5]. - Advanced packaging is experiencing a supply-demand imbalance due to AI-driven demand, with expectations for growth trends to continue until 2025. The report highlights the increasing importance of advanced packaging in the computing era, which is expected to benefit the related industry chain [4][5]. - Seagate Technology has announced a price increase for its hard drives, indicating that supply constraints will persist and prices are expected to continue rising in the coming quarters. The report suggests that as downstream demand improves, storage chip prices are likely to continue their upward trend, benefiting the related industry chain [4][5]. Summary by Sections 1. Core Insights and Investment Recommendations - The report continues to favor the computing chip industry chain centered around AI, the rapidly developing HBM industry chain, and the semiconductor cycle recovery represented by storage and advanced packaging [5][6]. 2. Market Review - During the week of April 22-26, the A-share Shenwan Electronics Index rose by 5.21%, outperforming the CSI 300 Index by 4.01 percentage points. The performance of the six major sub-sectors of Shenwan Electronics was led by components (6.8%) and other electronics II (6.73%) [7][9]. 3. Industry News - SK Hynix is expected to adopt TSMC's 7nm process for the base die of HBM4 memory, with a target to achieve production by 2026 [17]. - Seagate Technology has announced a price increase for its hard drives due to ongoing supply constraints and rising costs [18]. - SoftBank plans to invest approximately $960 million in computing infrastructure to develop a trillion-parameter large model [19]. - Samsung and AMD have signed a supply agreement worth 4 trillion KRW for HBM3E 12H [20]. 4. Company Dynamics - Jiangbolong reported a 200.54% year-on-year increase in revenue for Q1, with new major clients like OPPO [26][27].