这类芯片，需求强劲

Core Viewpoint - Despite increasing macroeconomic uncertainties, TSMC maintains its advanced packaging investment plans based on the strong expected demand for AI semiconductors in the medium to long term [1][2]. Group 1: TSMC's Investment and Strategy - TSMC announced a capital expenditure (CapEx) of $38 billion to $42 billion for this year, maintaining its investment plans despite uncertainties in AI infrastructure investment due to low-cost AI models and tariff pressures from the U.S. [1] - TSMC expects a compound annual growth rate (CAGR) of 45% for AI accelerator-related sales from 2024 to 2029, with this year's sales projected to double compared to last year [2]. Group 2: Advanced Packaging and HBM Demand - TSMC plans to double its CoWoS (Chip on Wafer on Substrate) capacity to 70,000 units per month, which is crucial for high-performance AI accelerators and HBM [2]. - The expansion of advanced packaging investments benefits the HBM memory industry, with companies like SK Hynix supplying HBM to major cloud service providers and AI leaders like NVIDIA [2]. Group 3: HBM Market Dynamics - SK Hynix aims to increase the proportion of its 12-layer products to over half of its total HBM3E shipments in the first half of this year, indicating a strong focus on high-value HBM production [3]. - Samsung and Micron are also expanding their HBM businesses, with Samsung developing an improved version of HBM3E and Micron completing the development of 12-layer HBM3E [3].