台积电，赢麻了

Core Viewpoint - In 2024, TSMC has solidified its position as a leader in the semiconductor industry, driven by the explosive demand for AI-related chips, achieving significant growth in revenue and profitability while expanding its global strategic footprint [1][2][3]. Financial Performance - TSMC's consolidated revenue for 2024 reached $90 billion, a 30% increase year-on-year, with a net profit of $36.5 billion, reflecting a substantial growth of 35.9% [2]. - The gross margin was reported at 56.1%, and the operating margin reached 45.7%, both marking historical highs for the company [2]. Market Position and Client Base - TSMC holds a 34% market share in the IDM 2.0 industry, up from 28% in 2023, reinforcing its leadership in the foundry sector [2]. - The company provided 288 different process technologies to 522 clients, producing 11,878 different products, showcasing a highly diversified client base [3]. Product and Technology Development - Revenue from advanced processes of 7nm and below increased to 69%, significantly higher than the previous year's 58%, driven by demand in AI and high-performance computing [3]. - TSMC's revenue distribution by product platform shows high-performance computing products accounting for 51%, smartphones 35%, IoT 6%, automotive electronics 5%, and consumer electronics 1% [4]. Global Capacity Expansion - TSMC has established four GIGAFAB fabs in Taiwan, with an annual capacity exceeding 12.74 million 12-inch wafers, covering multiple technology nodes from 0.13 microns to 3 nanometers [13]. - The company has also made significant progress in its global manufacturing footprint, including a new fab in Arizona, USA, and a special process fab in Kumamoto, Japan [13][14]. Research and Development - TSMC invested 7.1% of its revenue in R&D in 2024, leading the foundry sector and surpassing many international tech giants [16]. - The company made key advancements in its 2nm platform, completing process definitions and entering yield improvement stages [16]. Advanced Packaging and Integration Technologies - TSMC's TSMC 3DFabric technology platform is crucial for performance enhancement in the post-Moore's Law era, focusing on system integration and advanced packaging solutions [17]. - The CoWoS technology family has been widely adopted in high-performance computing markets, particularly for integrating SoCs and high-bandwidth memory [19]. Emerging Technologies - TSMC is actively exploring new materials and extreme miniaturization techniques, including breakthroughs in carbon nanotube transistors and two-dimensional materials for future logic devices [23][24]. - The company is also developing new storage components optimized for AI edge devices, showcasing a commitment to innovation in high-density and energy-efficient storage solutions [25].