TSMC(US:TSM) 半导体芯闻·2025-04-24 10:39Core Viewpoint - TSMC is advancing its technology offerings, including the introduction of A14 process technology and enhancements in CoWoS technology, to meet the increasing demands of AI and high-performance computing applications [1][2]. Group 1: Technology Advancements - TSMC plans to mass-produce a 9.5x mask size CoWoS technology by 2027, which will allow for the integration of 12 or more HBM stacks into a single package, significantly upgrading from the current 3.3x CoWoS-L and last year's 8x [1]. - The introduction of SoW-X, based on CoWoS technology, aims to achieve 40 times the computational power of current CoWoS solutions, with plans for mass production in 2027 [2]. - New solutions include the compact general-purpose optical engine (COUPE) technology for silicon photonics integration and an integrated voltage regulator (IVR) for AI applications, offering 5 times the vertical power density compared to independent power management chips [2]. Group 2: Applications in Various Sectors - In the automotive sector, TSMC is addressing the stringent computational requirements of advanced driver-assistance systems (ADAS) and autonomous vehicles (AV) with its N3A process, which is nearing the final stage of AEC-Q100 Level 1 validation [3]. - For IoT applications, TSMC's ultra-low power N6e process is now in production, aimed at enhancing energy efficiency for edge AI tasks [3]. - The latest RF technology, N4C RF, supports high-speed, low-latency wireless connections for AI demands, providing a 30% reduction in power and area compared to N6RF+, with trial production expected in Q1 2026 [2].