这家设备公司被HBM带飞

Core Insights - The demand for TC (Thermal Compression) bonding machines is surging due to intensified competition in the HBM (High Bandwidth Memory) market, with major memory manufacturers vying for orders [1] - Hanmi Semiconductor dominates the HBM3E TC bonding machine market, holding a 90% market share [1] - Micron Technology plays a crucial role in Hanmi's sales, contributing to nearly 90% of its revenue from overseas, with significant capital expenditure directed towards HBM production and development [1] Group 1 - Hanmi Semiconductor has received a large order of approximately 50 TC bonding machines from Micron, significantly larger than previous shipments [1] - Micron is expanding its HBM production capabilities with new facilities in Singapore, Idaho, Hiroshima, and Taiwan, aiming to increase its HBM market share to match its 20-25% DRAM market share [1] - Chinese memory manufacturers are also advancing in HBM technology, with plans to develop HBM3 by 2026 and HBM3E by 2027, leading to increased orders for TC bonding machines [3] Group 2 - The expansion of HBM2 production capacity in China is driving up demand for TC bonding machines [3] - SK Hynix's HBM production capacity is nearing full utilization, which may lead Hanmi to rely more on orders from Micron and other global clients [3]