X @郭明錤 (Ming-Chi Kuo)

Company Highlights - Eternal Materials secured its first TSMC advanced packaging order [1] - The order includes exclusive MUF (Mold Underfill) and LMC (Liquid Molding Compound) for 2026 Apple chips [1] - Eternal Materials is positioned as a new CoWoS (Chip-on-Wafer-on-Substrate) beneficiary [1] Market Opportunity - The company is eyeing the global high-gross margin LMC market [1] - The global high-gross margin LMC market is estimated to be worth over NT$10 billion (approximately US$312.5 million, based on an exchange rate of 32 NTD/USD) [1]