HHCK(SH:688535) DT新材料·2025-05-06 16:02Core Viewpoint - The company Huahai Chengke reported a mixed financial performance for Q1 2025, with revenue growth but a significant decline in net profit due to increased costs related to employee stock incentives and depreciation from new facilities [1][2]. Financial Performance Summary - Q1 2025 revenue reached 83.87 million yuan, a year-on-year increase of 15.84% compared to 72.40 million yuan in the same period last year [2]. - Net profit attributable to shareholders decreased by 43.56% to 7.21 million yuan from 12.77 million yuan year-on-year [2]. - The company's net profit after excluding non-recurring items fell by 48.97% to 6.56 million yuan from 12.86 million yuan year-on-year [2]. Annual Performance Overview - For the full year 2024, Huahai Chengke achieved a revenue of 332 million yuan, up 17.23% from 283 million yuan in 2023 [3]. - The net profit attributable to shareholders for 2024 was 40.06 million yuan, reflecting a 26.63% increase from 31.64 million yuan in 2023 [3]. - The net profit after excluding non-recurring items rose by 24.59% to 34.13 million yuan from 27.40 million yuan year-on-year [3]. Product and Market Insights - Huahai Chengke specializes in the research, production, and sales of epoxy molding compounds and electronic adhesives, primarily used in semiconductor packaging and board-level assembly [4]. - The production of epoxy molding compounds reached 12,400 tons in the reporting period, marking a 20.40% increase, with revenue from this segment at 316 million yuan, up 18.81% [4]. - The adhesive segment saw a production decline of 20.92% to 36.23 tons, but revenue increased by 8.44% to 15 million yuan, with a gross margin of 35.05%, down 7.02 percentage points from the previous year [4]. Strategic Initiatives - The company is planning to acquire 100% of Hengsu Huawai through a combination of cash and stock issuance, which is expected to enhance production scale and efficiency [5]. - A project to build a high-density integrated circuit and system-level module packaging epoxy molding compound facility is underway, with an expected annual production capacity of 11,000 tons upon completion [5]. - As of the reporting period, the company has invested 184 million yuan in fundraising projects, achieving 63.83% of the planned progress [5].