FC-BGA，需求大增

Core Viewpoint - The Japanese circuit board industry leader, IBIDEN, predicts significant growth in the AI server circuit board market, with sales expected to increase 2.5 times over the next 5 to 6 years, benefiting domestic companies like Samsung Electronics and LG Innotek [1][2]. Group 1: Market Growth and Projections - IBIDEN forecasts an 11% year-on-year increase in total sales for the fiscal year 2025, with the electronic division's sales, including FC-BGA, projected to reach $24 billion and operating profit to hit $3.3 billion, reflecting growth of 22% and 23% respectively compared to the previous year [1]. - By fiscal year 2030, sales of AI server substrates are expected to grow approximately 2.5 times from 2024, reaching $47.5 billion [2]. - The global FC-BGA market is anticipated to more than double from $8 billion in 2022 to $16.4 billion by 2030 [2]. Group 2: Technological Trends and Innovations - FC-BGA substrates are becoming essential in high-performance electronics due to their ability to provide higher I/O density and improved electrical performance compared to traditional packaging methods [3]. - The demand for miniaturization and enhanced functionality in consumer electronics, particularly in smartphones and IoT devices, is driving the adoption of FC-BGA substrates [3]. - The rise of 5G technology necessitates semiconductors capable of handling high-frequency signals, making FC-BGA substrates ideal for RF and millimeter-wave applications [4][5]. - The growth of automotive electronics, particularly in electric vehicles (EVs), is increasing the demand for efficient packaging solutions like FC-BGA that can manage higher power densities [6]. - High-performance computing (HPC) and AI workloads require low-latency processors, and FC-BGA substrates support heterogeneous integration of multiple chips, crucial for data centers and edge devices [7]. - Sustainability is becoming a key factor in semiconductor manufacturing, with FC-BGA substrates contributing to reduced material usage and improved energy efficiency [8]. Group 3: Challenges and Future Outlook - Despite the advantages of FC-BGA technology, challenges such as higher production costs and complexities in testing and inspection remain [8]. - The future of FC-BGA substrates looks promising, with emerging trends in heterogeneous integration and system-in-package (SiP) solutions expected to enhance performance [8]. - The semiconductor packaging landscape is undergoing a paradigm shift, with FC-BGA technology playing a critical role in meeting the complex demands of modern electronic devices and systems [8][9].