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这里有一份AEIF 2025参会指南请查收
半导体芯闻·2025-05-12 10:08

Core Viewpoint - The "12th Automotive Electronics Innovation Conference and Automotive Chip Industry Ecosystem Development Forum (AEIF 2025)" will be held in Shanghai on May 14-15, focusing on cutting-edge automotive technologies and inviting industry experts to share insights on trends, innovations, and applications in the automotive electronics sector [1]. Event Overview - The conference theme is "Building Industry Ecosystem and Moving Forward with Opportunities," featuring a summit forum, supply-demand matching, three specialized forums, and a product exhibition, with over a thousand attendees expected [1]. - The organizing committee aims to enhance connections between upstream and downstream players in the automotive industry, providing robust showcasing opportunities for capable automotive chip companies to engage directly with vehicle manufacturers and Tier 1 suppliers [1]. Agenda Highlights - The event includes a VIP and exhibitor registration on May 14, followed by a closed-door meeting for automotive electronics experts and a supply-demand matching session [5]. - On May 15, the main summit forum will take place, along with specialized sessions focusing on automotive electronic ecosystems, smart connected vehicles, and AI in autonomous driving [5][30][34]. Key Speakers and Topics - Notable speakers include experts from various companies discussing the current state and future of automotive chip development, including the challenges and opportunities in localizing chip production in China [12][22]. - Topics will cover the demand for chips in smart vehicles, the role of RISC-V architecture in the industry, and advancements in chiplet technology for automotive applications [13][14][23]. Industry Trends - The automotive electronics system is projected to account for 30-70% of the total value of vehicles, highlighting its significance in technological innovation [22]. - The demand for automotive chips is surging due to the rapid growth of smart and new energy vehicles, with a focus on the evolution of chip integration and architecture in the automotive sector [23][28].