Chiplet万里长征，只走了一步

Core Insights - The article discusses the evolution and challenges of chiplet technology in the semiconductor industry, emphasizing the need for a standardized ecosystem to facilitate its growth and integration [1][2][3]. Chiplet Ecosystem - Chiplet technology represents a significant advancement in semiconductor functionality and productivity, akin to the impact of soft IP 40 years ago, but the ecosystem remains in its infancy [1]. - Many companies are reaching the limits of photomasks and are compelled to adopt multi-chip solutions, yet a plug-and-play chip market has not emerged [1][2]. - The concept of chiplets is based on modularity, allowing for faster task completion and higher yields, but it introduces new challenges that require ongoing problem-solving [1][3]. Need for Standards - There is a pressing need for standardization across packaging, testing, design, and interconnects, as the current landscape resembles a "wild west" with numerous proprietary standards [2][3]. - The industry is moving towards the adoption of standards like UCIe, but it may take several years, potentially until the 2030s, for standardized chiplets to become prevalent [1][2][3]. Organizational Challenges - Companies must reassess their organizational structures to foster collaboration among various departments such as packaging, thermal management, and chip design, which are currently siloed [5][6]. - Effective planning and testing processes are crucial, as issues can arise if functionality is not properly distributed across multiple dies [5][6]. Tools and Processes - The complexity of heterogeneous integration necessitates a complete verification environment to ensure that all components function together effectively [7][8]. - Current tools are insufficient for seamless integration, requiring custom environments to support parallel development projects [7][9]. - System-level co-design is essential for multi-chip integration, involving thermal, power, and interconnect models to ensure reliable communication between chips [8][9]. Industry Collaboration - Successful applications require sufficient interest from multiple companies to collaborate on standards related to packaging, power delivery, and signal pin assignments [5][6]. - The industry must clarify what chip suppliers need to provide and how to maintain security and integrity when integrating components from different vendors [9].